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  • Interconnection of 400G and 800G Optical Modules with MPO Patch Cords
    Interconnection of 400G and 800G Optical Modules with MPO Patch Cords
    • October 15. 2026

    With the upgrading of data center bandwidth, large-scale deployment of 400G and commercial deployment of 800G have become mainstream. 400G/800G optical modules adopt a parallel multi-channel transmission architecture and rely on MPO high-density patch cords to achieve multi-optical path integrated transceiver, which is the core interconnection method for current high-speed networking. The number o...

  • Analysis of Trends in the Localization of Optical Module Chips
    Analysis of Trends in the Localization of Optical Module Chips
    • October 13. 2026

    China country has captured over 60% of the global optical module manufacturing capacity, but behind this impressive overall production capacity, high-end optical chips and high-speed DSP chips remain the weakest links in the industry chain. With the explosive growth of AI computing power, the accelerated adoption of 800G, and the commencement of 1.6T mass production, the self-sufficiency and contr...

  • Analysis of Global AI Computing Power Development Trends
    Analysis of Global AI Computing Power Development Trends
    • October 10. 2026

    The Race and Shifts in the Trillion-Dollar Market In 2026, the global AI computing power industry stands at an unprecedented historical juncture. Ⅰ.Computing Power: An Exponential Increase According to the latest report released by an industry research institution, as of June 2025, the total computing power of global computing devices reached 4495 EFlops, a significant year-on-year increase of 117...

  • 800G OSFP Package Comparison: RHS vs. IHS
    800G OSFP Package Comparison: RHS vs. IHS
    • October 09. 2026

    With the large-scale deployment of 800G AI computing clusters, many buyers only focus on optical parameters such as SR8/DR8/FR4 during procurement, neglecting the differences between IHS and RHS packaging. This leads to problems such as modules not fitting into the cage, insufficient heat dissipation, and project delays. This article thoroughly explains the differences between the two mainstream O...

  • 100G QSFP28 Optical Module Features and Selection Analysis
    100G QSFP28 Optical Module Features and Selection Analysis
    • October 08. 2026

    Smooth video streaming, instant cloud file transfers, and 24/7 high-speed operation of big data centers all rely on an unassuming "network hero"—the 100G QSFP28 optical module. Many people only know about its fast network speed, but they don't understand its true capabilities, applicable scenarios, or the most common pitfalls in choosing it. Today, we 'll use super easy-to-understand, practical in...

  • The Connection Between PCB and AI (Supplement Part)
    The Connection Between PCB and AI (Supplement Part)
    • September 30. 2026

    Previously, we clarified the value logic, market growth, product stratification, and technological upgrade requirements brought about by the iteration of high-speed optical modules for PCB in the AI era, and outlined the industry dividends of high-speed motherboards and backplanes. Building on this, this article makes a key addition: the true high-value core and high-barrier track in the AI and PC...

  • In-Depth Analysis of Industry Policies for Optical Modules
    In-Depth Analysis of Industry Policies for Optical Modules
    • September 28. 2026

    In the past, when discussing AI computing power, everyone's attention was focused on GPU and servers, but in 2026, the trend completely changed. From top-level documents from the Ministry of Industry and Information Technology and the National Development and Reform Commission to a series of support plans from Guangdong Province and Shenzhen, a series of important policies have been implemented in...

  • Part Ⅱ: What is the Value of PCB in the AI ERA
    Part Ⅱ: What is the Value of PCB in the AI ERA
    • September 23. 2026

    In the previous article, we analyzed the value logic, market growth, product stratification, and technological barriers of PCB in the AI era. Today, we will explore the upstream materials and midstream HDI (High-Intensity Distributed Assembly) sectors along the industry chain, and extend to the key downstream scenario of optical module packaging. Ⅰ.Upstream Materials: Leading in Scale, but Constra...

  • Part I: The Relationship Between PCB and AI
    Part I: The Relationship Between PCB and AI
    • September 21. 2026

    When people mention PCB (Printed Circuit Board), many think of it as just an ordinary green board used in electronic products for soldering chips and connecting cables. But few know that in today's era of skyrocketing AI computing power, a dedicated PCB for AI servers costs 1000 times more than a circuit board for ordinary household appliances! Today we'll break down the seemingly insignificant PC...

  • 25G BIDI 80km Optical Module - The Preferred Solution for Long-Distance Transmission
    25G BIDI 80km Optical Module - The Preferred Solution for Long-Distance Transmission
    • September 16. 2026

    Hello, everyone working in networking, system integration, and telecommunications operations and maintenance! Friends often ask me: For remote base stations, field security, and the renovation of old government and enterprise dedicated lines, the business needs to run 25G and the distance needs to be 80km, but we only have single-core optical fiber left and do not want to lay new lines, is there a...

  • How To Distinguish Between DAC and ACC?
    How To Distinguish Between DAC and ACC?
    • September 14. 2026

    Those who work in data center, switch maintenance, and GPU cluster deployment are often confused by two types of cables: DAC Passive Copper Cable and ACC Active Copper Cable. They look almost identical, have completely interchangeable interfaces, and are both high-speed copper cables, leading many to choose based on intuition alone, resulting in: 1)Excessive signal attenuation and packet loss due ...

  • The Clash Between Optical Modules and the Computing Power of CPU and GPU
    The Clash Between Optical Modules and the Computing Power of CPU and GPU
    • September 07. 2026

    Ⅰ.Computing Power Constraints: The Bottleneck Lies in Transmission, and the Key Lies in Optical Modules Against the backdrop of the rapid expansion of the AI industry, the market has long focused on computing chips such as CPU and GPU, but has neglected optical communication hardware that carries massive data flows. In an interview,  NVIDIA CEO Jensen Huang pointed out a key pain point i...

    A total of

    71

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