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Introduction: When selecting components for data center, 5G communication, and enterprise networking projects, many procurement and engineering personnel focus on the following: Does the optical module have formal certification? Can it be exported overseas? Is it stable for long-term, large-scale use? As a core component for photoelectric conversion, the certification of optical modules is not jus...
In the optical communication industry, when selecting and developing optical modules, companies often focus on speed, transmission distance, and compatible equipment, but rarely delve into the core optical component—the OSA (Optical Sub-module). In fact, the iterative upgrade of optical module speed is essentially an iteration of the OSA optical architecture, light emission principle, and signal c...
Optical module compatibility is crucial for stable network operation, and it mainly falls into two categories: hardware compatibility and software compatibility. Hardware ensures normal physical layer connection, while software enables module identification, link negotiation, and normal functioning. The vast majority of optical module port downtime, disconnections, and malfunctions are caused by h...
Looking at high-speed optical interconnects from the front lines of the industry, AI computing architecture is reshaping the demand curve for optical modules. Recent industry growth expectations have been continuously revised upwards, with 800G currently in a golden window for large-scale delivery, while the next-generation 1.6T is rapidly approaching. Leaving aside research report rhetoric, we'll...
With the upgrading of data center bandwidth, large-scale deployment of 400G and commercial deployment of 800G have become mainstream. 400G/800G optical modules adopt a parallel multi-channel transmission architecture and rely on MPO high-density patch cords to achieve multi-optical path integrated transceiver, which is the core interconnection method for current high-speed networking. The number o...
China country has captured over 60% of the global optical module manufacturing capacity, but behind this impressive overall production capacity, high-end optical chips and high-speed DSP chips remain the weakest links in the industry chain. With the explosive growth of AI computing power, the accelerated adoption of 800G, and the commencement of 1.6T mass production, the self-sufficiency and contr...
The Race and Shifts in the Trillion-Dollar Market In 2026, the global AI computing power industry stands at an unprecedented historical juncture. Ⅰ.Computing Power: An Exponential Increase According to the latest report released by an industry research institution, as of June 2025, the total computing power of global computing devices reached 4495 EFlops, a significant year-on-year increase of 117...
With the large-scale deployment of 800G AI computing clusters, many buyers only focus on optical parameters such as SR8/DR8/FR4 during procurement, neglecting the differences between IHS and RHS packaging. This leads to problems such as modules not fitting into the cage, insufficient heat dissipation, and project delays. This article thoroughly explains the differences between the two mainstream O...
Smooth video streaming, instant cloud file transfers, and 24/7 high-speed operation of big data centers all rely on an unassuming "network hero"—the 100G QSFP28 optical module. Many people only know about its fast network speed, but they don't understand its true capabilities, applicable scenarios, or the most common pitfalls in choosing it. Today, we 'll use super easy-to-understand, practical in...
Previously, we clarified the value logic, market growth, product stratification, and technological upgrade requirements brought about by the iteration of high-speed optical modules for PCB in the AI era, and outlined the industry dividends of high-speed motherboards and backplanes. Building on this, this article makes a key addition: the true high-value core and high-barrier track in the AI and PC...
In the past, when discussing AI computing power, everyone's attention was focused on GPU and servers, but in 2026, the trend completely changed. From top-level documents from the Ministry of Industry and Information Technology and the National Development and Reform Commission to a series of support plans from Guangdong Province and Shenzhen, a series of important policies have been implemented in...
In the previous article, we analyzed the value logic, market growth, product stratification, and technological barriers of PCB in the AI era. Today, we will explore the upstream materials and midstream HDI (High-Intensity Distributed Assembly) sectors along the industry chain, and extend to the key downstream scenario of optical module packaging. Ⅰ.Upstream Materials: Leading in Scale, but Constra...
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