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Previously, we clarified the value logic, market growth, product stratification, and technological upgrade requirements brought about by the iteration of high-speed optical modules for PCB in the AI era, and outlined the industry dividends of high-speed motherboards and backplanes. Building on this, this article makes a key addition: the true high-value core and high-barrier track in the AI and PC...
In the past, when discussing AI computing power, everyone's attention was focused on GPU and servers, but in 2026, the trend completely changed. From top-level documents from the Ministry of Industry and Information Technology and the National Development and Reform Commission to a series of support plans from Guangdong Province and Shenzhen, a series of important policies have been implemented in...
In the previous article, we analyzed the value logic, market growth, product stratification, and technological barriers of PCB in the AI era. Today, we will explore the upstream materials and midstream HDI (High-Intensity Distributed Assembly) sectors along the industry chain, and extend to the key downstream scenario of optical module packaging. Ⅰ.Upstream Materials: Leading in Scale, but Constra...
When people mention PCB (Printed Circuit Board), many think of it as just an ordinary green board used in electronic products for soldering chips and connecting cables. But few know that in today's era of skyrocketing AI computing power, a dedicated PCB for AI servers costs 1000 times more than a circuit board for ordinary household appliances! Today we'll break down the seemingly insignificant PC...
Ⅰ.Computing Power Constraints: The Bottleneck Lies in Transmission, and the Key Lies in Optical Modules Against the backdrop of the rapid expansion of the AI industry, the market has long focused on computing chips such as CPU and GPU, but has neglected optical communication hardware that carries massive data flows. In an interview, NVIDIA CEO Jensen Huang pointed out a key pain point i...
Reuters reports that the U.S. FCC is pushing forward with new regulations that plan to restrict the entry of Chinese-made 1.6T and 3.2T high-speed optical modules into the U.S. market. On August 7, a third supplementary rule announcement was released, officially opening a 30-day comment period followed by a 45-day response period for public feedback. The US has repeatedly raised the issue of "data...
The true core strength and the industry's biggest bottleneck—Indium Phosphide (InP) —is the only core substrate material for high-speed optical modules, EML lasers, detectors, and optical chips . China holds more than 70% of the world's refined indium production capacity and has long included indium phosphide in its export control list. Coupled with the continuous explosion of AI computing power, ...
Today, optical modules are rapidly iterating from 800G to 1.6T and 3.2T, and optical chip materials and integration routes have become the core points of competition in the industry. Indium phosphide (InP), electro-absorption modulated lasers (EML), silicon-based optoelectronics (SiPho/silicon photonics), and thin-film lithium niobate (TFLN) are not parallel substitutes, but rather a progressive s...
As the AI computing power race intensifies, Google is aggressively expanding its global computing infrastructure. In this arms race, optical modules, serving as the "highway" for data transmission, have become one of the core procurement categories for Google's data center construction. Based on data from third-party organizations such as TrendForce and LightCounting, the following outlines the ke...
A race to build AI infrastructure with no turning back. In 2026, the US data center industry is experiencing an unprecedented expansion. According to the latest data from TrendForce, the combined capital expenditure of the world's nine largest cloud service providers is projected to reach $830 billion in 2026, a significant year-on-year increase of 79%. Among them, the four major North American te...
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