As data center speeds advance towards 800G and even 1.6T, a technology called "silicon photonics" is changing the optical module industry landscape with unprecedented momentum. So, what are the differences between silicon photonics modules and the traditional optical modules we are familiar with?
Core Difference 1: Technical Approach and Materials
Traditional optical modules employ a "hybrid integration" technology. Their core light-emitting component—the laser—is typically made of III-V compound semiconductor materials such as indium phosphide (InP); modulators, detectors, etc., may use gallium arsenide (GaAs) or lithium niobate (LiNbO3). Functionality is achieved through multi-stage assembly, similar to "assembling a precision clock from scattered parts."
The core technology of silicon optical modules is "optoelectronic co-packaging". It uses mainstream silicon (Si) as the optical substrate and, through advanced semiconductor processes, directly "carves" most of the optical components such as waveguides, modulators, and detectors on the silicon wafer to achieve optical path integration. It is like "micro-carving a complete functional system on a single crystal".
Core Difference 2: Integration Level and Size
Due to limitations in materials and manufacturing processes, traditional optical modules contain numerous internal components and have complex structures. As speeds increase, it becomes increasingly difficult to further reduce their size in order to accommodate more channels (such as 4x100G or 8x100G), and the challenges of power consumption and heat dissipation become more and more severe.
Silicon photonics modules, with their extremely high integration, can integrate multiple optical functions onto a single tiny chip. This allows them to achieve the same or even higher bandwidth while being smaller and denser. This is undoubtedly a huge advantage for data center switches, where space is extremely precious.
Core Difference 3: Cost and Scalability
Traditional optical module manufacturing relies heavily on manual alignment, packaging, and testing, especially for high-speed products where extremely high precision is required, resulting in high costs. This technological approach encounters bottlenecks when scaling to even higher speeds.
The manufacturing process of silicon photonics modules is compatible with mature CMOS integrated circuit processes, meaning it can leverage the existing vast semiconductor supply chain to achieve large-scale, standardized production. Once the technology matures, its cost reduction potential is enormous, and it is easier to evolve to higher speeds and more complex functions, exhibiting excellent scalability.
Core Difference 4: Performance
Traditional optical module technology is mature, with stable and reliable performance, and still has irreplaceable advantages in specific application scenarios (such as ultra-long-distance transmission).
Silicon photonics modules offer significant advantages in power consumption and integration. However, their lasers (light sources) currently require external coupling, which remains a technical challenge. Nevertheless, with the development of CPO (co-packaged optics) technology, silicon photonics can package the optical engine and switching chip closer together, further reducing power consumption and latency – exactly what future hyperscale data centers crave.
ETU-LINK Views and Summary
In conclusion, silicon photonics technology is not intended to completely replace traditional optical modules, but rather to demonstrate stronger vitality and development potential in specific areas (especially high-speed data center short-range interconnects).
As an active participant in the optical communications field, ETU-LINK has always kept pace with technological development trends. We deeply understand that silicon photonics technology is one of the key engines driving the industry towards higher bandwidth and lower costs. We have already deployed and continue to invest in research and development, committed to providing customers with more competitive high-speed optical interconnect solutions.
The future is here, ETU-Link Technology Co., Ltd. will embrace the silicon photonics era with you and connect to infinite possibilities!
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