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Today, optical modules are rapidly iterating from 800G to 1.6T and 3.2T, and optical chip materials and integration routes have become the core points of competition in the industry. Indium phosphide (InP), electro-absorption modulated lasers (EML), silicon-based optoelectronics (SiPho/silicon photonics), and thin-film lithium niobate (TFLN) are not parallel substitutes, but rather a progressive s...
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