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  • Comparison of COB Packaging vs. Coaxial Processes in Short-Distance Optical Modules
    Comparison of COB Packaging vs. Coaxial Processes in Short-Distance Optical Modules
    • December 17. 2025

    In the field of short-range optical communication, the packaging technology of optical modules directly affects product performance, cost, and application adaptability. COB (Chip On Board) packaging and coaxial technology, as two mainstream technologies, differ significantly in structural design and performance. This article will analyze the differences between the two from key dimensions to assis...

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