• December 10. 2024

In the field of optical communication, the packaging of optical devices plays a crucial role in the performance and application of optical modules. Common optical device packaging methods include COB (chip-on-board packaging), BOX and coaxial packaging. Today, we will discuss the differences between them to help you better understand their characteristics and application scenarios. I. COB package ...

• December 17. 2025

In the field of short-range optical communication, the packaging technology of optical modules directly affects product performance, cost, and application adaptability. COB (Chip On Board) packaging and coaxial technology, as two mainstream technologies, differ significantly in structural design and performance. This article will analyze the differences between the two from key dimensions to assis...