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When people mention PCB (Printed Circuit Board), many think of it as just an ordinary green board used in electronic products for soldering chips and connecting cables. But few know that in today's era of skyrocketing AI computing power, a dedicated PCB for AI servers costs 1000 times more than a circuit board for ordinary household appliances! Today we'll break down the seemingly insignificant PC...
Ⅰ.Computing Power Constraints: The Bottleneck Lies in Transmission, and the Key Lies in Optical Modules Against the backdrop of the rapid expansion of the AI industry, the market has long focused on computing chips such as CPU and GPU, but has neglected optical communication hardware that carries massive data flows. In an interview, NVIDIA CEO Jensen Huang pointed out a key pain point i...
Reuters reports that the U.S. FCC is pushing forward with new regulations that plan to restrict the entry of Chinese-made 1.6T and 3.2T high-speed optical modules into the U.S. market. On August 7, a third supplementary rule announcement was released, officially opening a 30-day comment period followed by a 45-day response period for public feedback. The US has repeatedly raised the issue of "data...
The true core strength and the industry's biggest bottleneck—Indium Phosphide (InP) —is the only core substrate material for high-speed optical modules, EML lasers, detectors, and optical chips . China holds more than 70% of the world's refined indium production capacity and has long included indium phosphide in its export control list. Coupled with the continuous explosion of AI computing power, ...
Today, optical modules are rapidly iterating from 800G to 1.6T and 3.2T, and optical chip materials and integration routes have become the core points of competition in the industry. Indium phosphide (InP), electro-absorption modulated lasers (EML), silicon-based optoelectronics (SiPho/silicon photonics), and thin-film lithium niobate (TFLN) are not parallel substitutes, but rather a progressive s...
As the AI computing power race intensifies, Google is aggressively expanding its global computing infrastructure. In this arms race, optical modules, serving as the "highway" for data transmission, have become one of the core procurement categories for Google's data center construction. Based on data from third-party organizations such as TrendForce and LightCounting, the following outlines the ke...
A race to build AI infrastructure with no turning back. In 2026, the US data center industry is experiencing an unprecedented expansion. According to the latest data from TrendForce, the combined capital expenditure of the world's nine largest cloud service providers is projected to reach $830 billion in 2026, a significant year-on-year increase of 79%. Among them, the four major North American te...
Let’s Talk About the “Invisible Ears” and “Smart Brains” Hidden Within the Internet of Everything. Have you ever wondered how your phone can accurately recognize your voice when you say "Hey Siri" in a noisy environment? How does radar transmit signals to the vehicle's computer in milliseconds when it detects an obstacle in front of the vehicle to make a braking decision? Behind these "smart momen...
I. Basic Definition of TEC TEC stands for thermoelectric cooler, a miniature semiconductor solid-state temperature control element. Lasers in optical modules are highly sensitive to temperature; temperature fluctuations can easily cause problems such as wavelength shift, power instability, and signal degradation. Therefore, mid-to-high-end high-speed optical modules commonly incorporate miniature ...
In optical communication network design, one of the most frequently asked questions engineers are asked is: "How far can this optical fiber actually transmit?" It seems like a simple question, but behind it lies a rigorous set of calculation logic. Today, let's break down how the transmission distance of an optical module is calculated. Ⅰ.Two Major Obstacles: Loss and Dispersion The transmission d...
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