• September 23. 2026

In the previous article, we analyzed the value logic, market growth, product stratification, and technological barriers of PCB in the AI era. Today, we will explore the upstream materials and midstream HDI (High-Intensity Distributed Assembly) sectors along the industry chain, and extend to the key downstream scenario of optical module packaging. Ⅰ.Upstream Materials: Leading in Scale, but Constra...

• September 21. 2026

When people mention PCB (Printed Circuit Board), many think of it as just an ordinary green board used in electronic products for soldering chips and connecting cables. But few know that in today's era of skyrocketing AI computing power, a dedicated PCB for AI servers costs 1000 times more than a circuit board for ordinary household appliances! Today we'll break down the seemingly insignificant PC...